史保新,张鑫,马国远
SHI Bao-xin1,ZHANG Xin2,MA Guo-yuan2(1.Guangdong Technology of University

• 1:广东工业大学
• 2:北京工业大学

摘要(Abstract)：

结合间接热虹吸管和扁平热管的特点,研制出一种新型电子器件用复合热管散热器,并试验分析了该散热器分别使用甲醇、乙醇、丙酮、水和R123等工质的散热性能以及充灌率和风速等设计因素对其散热性能的影响。试验结果表明:该复合型散热器在较宽广的热流量范围内和较大热流量的情况下均具有良好的性能,不管热流量突变还是稳定,该复合型热管散热器都可以使电子器件表面温度保持平稳,不出现大幅度波动;工质为R123时的散热效果最好,当热流量为200W时,可以保证电子元件表面温度低于70℃。电子器件常用的热流量范围即在100~140W内,散热器适宜的充灌率约为80%。
To improve the performance of the radiator for electronic component,the indirect thermosyphon radiator coupled with flat heat pipe is developed.The characteristics of this compound radiator charged with methanol,ethanol,acetone,water and R123,respectively,are experimented,and the influences of charging rate and wind velocity on the radiating effect are discussed.The results demonstrate that the compound radiator owns favorable performances under wide range of radiation power,especially in heavy duty,and it is able to keep the temperature in junction layer die steady whether the radiating power varies smoothly or suddenly.The radiator charged with R123 can attain better performances and keep the temperature in junction layer less than 700C when the radiating power is even as high as 200W.The optimum charge rate of the radiator is about 80% when the radiating power varies from 100W to 140W.

关键词(KeyWords)： 热管;散热器;电子器件;试验研究
heat pipe;radiator;electronic component;experimental research

Abstract:

Keywords:

基金项目(Foundation):

作者(Author): 史保新,张鑫,马国远
SHI Bao-xin1,ZHANG Xin2,MA Guo-yuan2(1.Guangdong Technology of University

参考文献(References)：

• [1]殷际英.热管式CPU散热器总传热能力的研究[J].北方工业大学学报,2003,3(1):46-49.
• [2]庄骏,张红.热管技术及其工程应用[M].化学工业出版社,2000,(6):99-106.
• [3]刘思光.电子元器件液体自循环冷却系统的传热特性与试验研究[D].北京工业大学硕士学位论文,2006.20-40.
• [4]Yaxiong Wang,Peterson1 G P.Investigation of a No-vel Flat Heat Pipe[J].Journal of Heat Transfer,2005,12-165.
• [5]Phil E Tuma.Hamid R Mortazavi.Indirect thermosy-phons for cooling electronic devices[J].Electronicscooling,2006,(1):26-29.
• [6]张鑫.电子器件复合型热管散热器的性能分析与试验研究[D].北京工业大学硕士学位论文,2006.10-80.
• [7]吴治娟.CPU重力热管应用不同天然工质特性的研究[D].重庆大学硕士毕业论文,2002.34-60.