池勇,汤勇,万珍平,陈平
CHI Yong,TANG Yong,WAN Zhen-ping,CHEN Ping(South China University of Technology

• 1:华南理工大学
• 2:华南理工大学
• 3:华南理工大学
• 4:华南理工大学 广东广州510640

摘要(Abstract)：

介绍了微电子芯片高热流密度相变冷却技术,包括热管、热虹吸、环路热管、毛细泵吸环路,分析了各自的优缺点,提出LHP和CPL技术是唯一能替代热管技术的先进相变冷却技术,将是今后微电子芯片高热流密度冷却的主要方向。
Phase-change cooling technique was introduced for high heat flux,including heat pipe,thermosyphon,loop heat pipes(LHP),capillary pumped loops(CPL),and their merits and shortcomings were analyzed;Only LHP and CPL was put forword can replace heat pipe to realize the advanced phase-change cooling,and they are the main stream of the high heat flux cooling for micro electronic chips.

关键词(KeyWords)： 芯片冷却;热管(HP);热虹吸;环路热管(LHP);毛细泵吸环路(CPL)
cooling chips;heat pipe(HP);thermosyphon;loop heat pipes(LHP);capillary pumped loops(CPL)

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金项目(50436010,50375055);; 广东省自然科学基金项目(04105942)

作者(Author): 池勇,汤勇,万珍平,陈平
CHI Yong,TANG Yong,WAN Zhen-ping,CHEN Ping(South China University of Technology

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