用于电子冷却的热管性能分析Thermal Performance Analysis of Heat Pipe Used in Electronics Cooling
张亚平,冯全科,余小玲
ZHANG Ya-ping1,2,FENG Quan-ke1
摘要(Abstract)：
进行了充水热管、铜棒及空热管的热性能对比实验,结果表明热管利用水的两相沸腾换热来对功率模块内的集中热源进行扩散,其热扩散能力大大高于以导热热扩散的金属基板,利于消除芯片中出现的热点,用于电子冷却比金属导热块有更大的优势,并且热源方向和重力对金属烧结粉末热管几乎没有影响。当蒸发端在冷凝端顶部时,槽道和丝网芯热管不理想,均温效果差。提出采用一种简化热管数学模型进行有限元模拟,大大缩短了计算时间和工作量。
Compared with that of copper substrate and empty heat pipe,the heat transfer performance of the heat pipe filled with water was experimentally measured.Experiment result indicates that the heat pipe uses two-phase boiling heat transfer to diffuse heat in power module,is avail to eliminate hot spot and thus improve the thermal performance of the power module.Heat pipe have more predominance than metal copper.Heat source direction and gravitation have little effect on thermal performance for sinter metal powder.when evaporator side is on the top of condenser side thermal performance for heat pipe of groove and mesh screen wick are too bad Provide a simplified model,utilize ANSYS finite element simulation and greatly shorten calculate time and workload,simultaneity obtain satisfactional result.
关键词(KeyWords)：
热管;电子冷却;热性能
heat pipe;electronics cooling;thermal performance
基金项目(Foundation): 台达环境与教育基金会《电力电子科技发展计划》
作者(Author):
张亚平,冯全科,余小玲
ZHANG Ya-ping1,2,FENG Quan-ke1
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