R32中间补气压缩空气源热泵系统的试验研究Experimental Study on Performance of Economized Vapor Injection Heat Pump System Using Refrigerant R32
张新玉,郭宪民,张森林
ZHANG Xin-yu,GUO Xian-min,ZHANG Sen-lin
摘要(Abstract):
对以R32为工质带经济器的中间补气压缩空气源热泵系统进行了试验研究与分析。结果表明:在蒸发温度为-2~-15℃范围内,该系统的相对补气量、制热量和耗功均随着补气压力的升高而增大;当蒸发温度为-15℃时,最大相对补气量约为33%,同时排气温度可降低11℃;当蒸发温度为-6℃时,系统COP达到最大值时所对应的最佳补气压力范围是1.50~1.54 MPa。在蒸发温度低于-6℃的条件下,带经济器的中间补气压缩空气源热泵系统的制热性能具有明显的优势。
The performance of the EVI heat pump system using refrigerant R32 is investigated experimentally under the conditions of the evaporating temperature ranged from- 2℃ to- 15℃. The experimental results indicate that the injection ratio,heat capacity and power consumption of the EVI heat pump system increase with the injection pressure. The max injection ratio of the EVI heat pump system is about 33% under the evaporating temperature of- 15℃. For the EVI heat pump system,the system COP achieves the maximum value as the evaporating temperature is about- 6℃,and the optimum injection pressure ranges from1. 50 MPa to 1. 54 MPa. The discharge temperature of the EVI heat pump system drops by 11℃ under the evaporating temperature of- 15℃. As the evaporating temperature is below- 6℃,the COP of the EVI heat pump system is higher than that of the traditional single stage heat pump.
关键词(KeyWords):
R32热泵系统;经济器系统;相对补气量;系统性能
R32 heat pump system;economized vapor injection system;injection ratio;system performance
基金项目(Foundation):
作者(Author):
张新玉,郭宪民,张森林
ZHANG Xin-yu,GUO Xian-min,ZHANG Sen-lin
参考文献(References):
- [1]梅奎,李明,梁路军.R32和R410A循环特性对比研究[J].制冷与空调,2011,11(2):56-59.
- [2]张龙,刘煜.制冷剂R32在空调应用上的理论分析[J].制冷与空调,2010,10(3):76-78.
- [3]饶荣水.制冷剂R32特性及其用于空气源热泵热水器的理论循环分析[J].制冷与空调,2010,10(3):79-84.
- [4]王朝鑫,朱兴旺,龚毅.R32灌注式替代R410A家用空调的试验研究[J].流体机械,2011,39(7):65-67.
- [5]秦妍,张剑飞.R32制冷系统降低排气温度的方法研究[J].制冷学报,2010,33(1):14-17.
- [6]孔维利,屠冰,李旻阳.R32空气源热泵机组性能试验研究[J].制冷与空调,2013,13(1):48-51.
- [7]许树学,马国远,赵博,等.以R32为工质的准二级压缩热泵系统实验研究[J].制冷学报,2011,32(5):12-14.
- [8]Xu Shuxue,Ma Guoyuan,Liu Qi,et al.Experiment study of an enhanced vapor injection refrigeration/heat pump system using R32[J].International Journal of Thermal Sciences,2013,(68):103-109.